Redmi 6
Specs, Where to buy, FRP Bypass
Full Specifications
Network
Technology | GSM / CDMA / HSPA / LTE |
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Launch
Announced | 2018, June |
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Status | Released 2018, June |
Body
Dimensions | 147.5 x 71.5 x 8.3 mm (5.81 x 2.81 x 0.33 in) |
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Weight | 145 g (5.11 oz) |
Build | Glass front, plastic back, plastic frame |
SIM | Dual SIM (Nano-SIM, dual stand-by) |
Display
Type | IPS LCD |
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Size | 5.45 inches, 76.7 cm² (~72.7% screen-to-body ratio) |
Resolution | 720 x 1440 pixels, 18:9 ratio (~295 ppi density) |
Platform
OS | Android 8.1 (Oreo), planned upgrade to Android 10, MIUI 12 |
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Chipset | Mediatek MT6761 Helio A22 (12 nm) |
CPU | Quad-core 2.0 GHz Cortex-A53 |
GPU | PowerVR GE8320 |
Memory
Card slot | microSDXC (dedicated slot) |
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Internal | 16GB 2GB RAM, 32GB 2GB RAM, 32GB 3GB RAM (eMMC 5.1) |
Main Camera
Single | 13 MP, f/2.2, PDAF |
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Features | LED flash, HDR, panorama |
Video | 1080p@30fps |
Selfie Camera
Single | 5 MP, f/2.2 |
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Sound
Loudspeaker | Yes |
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3.5mm jack | Yes |
Comms
WLAN | Wi-Fi 802.11 b/g/n, Wi-Fi Direct |
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Bluetooth | 4.2, A2DP, LE |
Positioning | GPS, GLONASS, BDS |
NFC | No |
Radio | FM radio |
USB | microUSB 2.0 |
Features
Sensors | Accelerometer, proximity, compass |
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Battery
Type | Li-Ion 3000 mAh, non-removable |
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Misc
Colors | Black, Grey, Blue, Gold, Rose Gold |
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Models and Chipsets
Model | Chipset |
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M1804C3CG | Mediatek MT6761 Helio A22 (12 nm) |
M1804C3CH | Mediatek MT6761 Helio A22 (12 nm) |
M1804C3CI | Mediatek MT6761 Helio A22 (12 nm) |