Redmi 4 Prime
Specs, Where to buy, FRP Bypass
Full Specifications
Network
Technology | GSM / CDMA / HSPA / EVDO / LTE |
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Launch
Announced | 2016, November |
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Status | Released 2016, November, Discontinued |
Body
Dimensions | 141.3 x 69.6 x 8.9 mm (5.56 x 2.74 x 0.35 in) |
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Weight | 156 g (5.50 oz) |
Build | Glass front, aluminum back, aluminum frame |
SIM | Hybrid Dual SIM |
Display
Type | IPS LCD |
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Size | 5.0 inches, 68.9 cm² (~70.1% screen-to-body ratio) |
Resolution | 1080 x 1920 pixels, 16:9 ratio (~441 ppi density) |
Platform
OS | Android 6.0.1 (Marshmallow), MIUI 8 |
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Chipset | Qualcomm MSM8953 Snapdragon 625 (14 nm) |
CPU | Octa-core 2.0 GHz Cortex-A53 |
GPU | Adreno 506 |
Memory
Card slot | microSDXC (uses shared SIM slot) |
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Internal | 32GB 3GB RAM (eMMC 5.1) |
Main Camera
Single | 13 MP, f/2.2, PDAF |
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Features | Dual-LED dual-tone flash, HDR, panorama |
Video | 1080p@30fps |
Selfie Camera
Single | 5 MP, f/2.2 |
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Video | 1080p@30fps |
Sound
Loudspeaker | Yes |
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3.5mm jack | Yes |
Comms
WLAN | Wi-Fi 802.11 a/b/g/n, dual-band, Wi-Fi Direct |
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Bluetooth | 4.2, A2DP, LE |
Positioning | GPS, GLONASS, BDS |
NFC | No |
Infrared port | Yes |
Radio | FM radio |
USB | microUSB 2.0, OTG |
Features
Sensors | Fingerprint (rear-mounted), accelerometer, gyro, proximity, compass |
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Battery
Type | Li-Po 4100 mAh, non-removable |
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Charging | 10W wired |
Misc
Colors | Gold, Dark Gray, Silver |
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Models and Chipsets
Model | Chipset |
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Unknown | Qualcomm MSM8953 Snapdragon 625 (14 nm) |